首页> 外文期刊>Applied optics >Analysis of intrachip electrical and optical fanout
【24h】

Analysis of intrachip electrical and optical fanout

机译:芯片内电气和光学扇出分析

获取原文
获取原文并翻译 | 示例
           

摘要

We examine the benefits of electrical isolation in intrachip optical signaling. We calculate the delay and energy metrics of an optical interconnect with fanout driving an electrical load. By examining fanout and including load drivers into delay equations, we make a shift from the general trend of looking at optical interconnects as a replacement for long parasitic wires. Our calculations show that optical fanout provides a large improvement in an E_(tau~(2)) (energy delay squared) metric and improves performance even at very short intrachip distances. The break-even length corresponds to the wiring length of 250 minimum-size inverters that are compactly laid out. These results provide a compelling reason to further examine the implementation of optical interconnects.
机译:我们研究了芯片内光信号传输中电隔离的好处。我们通过扇出驱动电负载来计算光互连的延迟和能量指标。通过检查扇出并将负载驱动器包括在延迟方程中,我们从将光互连视为长寄生线的替代物的总趋势中得到了转变。我们的计算表明,光学扇出可以大大提高E_(tau〜(2))(能量延迟平方)度量,即使在非常短的芯片内距离下也可以提高性能。收支平衡长度对应于紧凑布局的250个最小尺寸逆变器的接线长度。这些结果为进一步检查光互连的实现提供了令人信服的理由。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号