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Time-resolved vibration measurement with temporal speckle pattern interferometry

机译:时间散斑图干涉法的时间分辨振动测量

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Temporal speckle pattern interferometry (TSPI) is an optical measurement procedure for measuring the displacement of rough technical surfaces. The time-dependent speckle modulation due to optical path difference changes is tracked during the whole displacement of the surface and then evaluated pointwise without referring to neighboring pixels. This feature allows for its use as independent point sensors. This aspect of incremental phase tracking enables TSPI to be used to measure time-resolved mechanical vibrations. It also reduces the deteriorating effect of the decorrelation. Therefore large displacements can be measured. A concept for an inexpensive fiber-optical point sensor was developed and the theoretical accuracy for vibration measurement was investigated. The TSPI measurement of a loudspeaker membrane is compared with a high-precision vibrometer measurement. The first results show good agreement.
机译:时间散斑图案干涉法(TSPI)是用于测量粗糙技术表面的位移的光学测量程序。在整个表面位移期间跟踪由于光程差变化而导致的与时间相关的斑点调制,然后逐点进行评估,而无需参考相邻像素。此功能使其可用作独立的点传感器。增量相位跟踪的这一方面使TSPI能够用于测量时间分辨的机械振动。它还减少了去相关的恶化作用。因此,可以测量大位移。开发了一种廉价的光纤点传感器的概念,并研究了振动测量的理论精度。将扬声器膜片的TSPI测量值与高精度振动计测量值进行比较。最初的结果显示出良好的一致性。

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