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首页> 外文期刊>Journal of Applied Polymer Science >Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles
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Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles

机译：导热AlN和BN陶瓷颗粒填充环氧树脂基复合材料的性能研究。

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摘要

To develop new composites with sufficiently high thermal conductivity and suitably controlled D_k value for PCBs application, the composites were prepared from epoxy and AlN or BN fillers, and the effects of content, size, size distribution, and morphology of two fillers on the thermal and dielectric properties of the composites were investigated. The results showed that either AlN or BN fillers can greatly increase T_g and thermal conductivity, decreasing CTE and D_f, and suitably controlling the increase of D_k. At the same filler content, BN-filled composites exhibit better thermal performance and dielectric properties compared to AlN-filled composites. In the case of BN-filled composites, it is found that plateletshaped micro-BN filled composite has lower T_g and higher CTE compared with particle-shaped nano-BN filled composite, but its thermal conductivity is remarkably higher than that of nano-BN filled composite. When hybrid BN fillers are used, thermal conductivity further increases. For micro-or nano-BN filled composite, the composite shows decreased T_g and increased D_k at high fraction of BN, but hybrid BN-filled composite still has high T_g and similar D_k with epoxy even if at high fraction of BN. Compared with single-sized AlN-filled composite, it is found that hybrid-sized AlN-filled composite has higher T_g and lower CTE, but has lower thermal conductivity. To predict thermal conductivity and D_k in the investigated materials system, different models reported in the literature were analyzed and compared with the experimental data. Finally, suitable models were recommended.
机译：为了开发具有足够高的导热率和适当控制的D_k值以用于PCB应用的新型复合材料，该复合材料由环氧树脂，AlN或BN填料制备，以及两种填料的含量，尺寸，尺寸分布和形态对导热性和热稳定性的影响。研究了复合材料的介电性能。结果表明，AlN或BN填料均可大大提高T_g和导热系数，降低CTE和D_f，并适当控制D_k的增加。在相同的填料含量下，BN填充的复合材料比AlN填充的复合材料表现出更好的热性能和介电性能。在填充BN的复合材料的情况下，发现与颗粒状纳米BN填充的复合材料相比，片状微BN填充的复合材料具有更低的T_g和更高的CTE，但其导热率明显高于填充纳米BN的复合材料。综合。当使用混合BN填料时，热导率进一步增加。对于微米或纳米BN填充的复合材料，该复合材料在高BN含量时显示出降低的T_g和D_k，但是即使在高BN含量下，混合BN填充复合材料仍然具有较高的T_g和与环氧树脂相似的D_k。与单一尺寸的AlN填充复合材料相比，发现混合尺寸的AlN填充复合材料具有较高的T_g和较低的CTE，但具有较低的热导率。为了预测所研究材料系统中的导热系数和D_k，对文献中报道的不同模型进行了分析，并与实验数据进行了比较。最后，推荐了合适的模型。

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