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首页> 外文期刊>鋳造工学 >Formation of Al4C3 in remelting of SiCp/Al-Si-Cu alloy using electron beam
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Formation of Al4C3 in remelting of SiCp/Al-Si-Cu alloy using electron beam

机译:使用电子束形成Al4C3在Refeling SICP / Al-Si-Cu合金中

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摘要

The contact of SiC particles with molten Al-Si-Cualloy may result in A14 C3 formation in the electron beamremelting of aluminum alloy matrix composites, depending uponthe matrix composition. It is known that the formation of Al4 C3 isaffected by melt temperature, holding time and silicon content inthe matrices, and also high silicon levels are required to preventthe A14 C3 formation. However, the influence of copper content onthe A14 C3 formation has not been clear. Therefore, the influenceof silicon and copper content on the A14 C3 formation was studied,and the following results were obtained : high copper and lowsilicon content promote the A14 C3 formation in electron beamremelting. The formed plate-like A14 C3 prevents the bead surfacefrom smoothing.
机译:根据基质组合物,熔融Al-Si-Cualloy的SiC颗粒与熔融Al-Si-Cualloy的接触可以导致铝合金基质复合材料的电子束射线中的A14 C3形成。 众所周知,通过熔融温度,保持时间和硅含量的矩阵的αC3形成,并且需要高硅水平来预防A14 C3形成。 然而,铜含量对A14 C3形成的影响尚未清楚。 因此,研究了硅和铜含量的影响,得到了以下结果:高铜和Lowsilicon含量促进电子束射井中的A14 C3形成。 形成的板状A14 C3可防止珠子表面平滑。

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