Life cycle analysis of electrically actuated SMA spring using Talbot interferometry

Disawal Reena; Nath Tameshwer; Prakash Shashi; Palani I. A.

摘要

Electrically actuated shape memory alloys (SMAs) find widespread applications in engineering and science. Such materials are known to retain/remember their state. In the stressed/deformed state, when activated by the application of a suitable excitation mechanism, such as the use of heat or potential, they return to their original unstressed state. To test their reliability, it is a standard procedure to undertake a life cycle analysis. In this paper, the life cycle analysis of a SMA spring using the Talbot interferometric technique is reported. The life cycle of the SMA spring is analyzed in terms of the displacement drift, which sets in because of the functional fatigue generated due to its repeated use. Collimated light from a He-Ne laser transmitted through a beam splitter is converged through a focusing lens onto a plane mirror attached to the spring. Backreflected light from the mirror is incident on a set of two Ronchi gratings separated by the Talbot distance, forming a moire pattern. The resulting interferograms are analyzed using a fringe rotation mechanism. The angle of orientation is a function of displacement drift. There is deterioration in the SMA property because of repeated cycles, and the spring loses its ability to return to its original unstretched position. The values of the displacement drift generated after 1, 1000, 2000, 3000, 4000, and 5000 such cycles as measured using a Talbot interferometer are 0, 0.875, 1.275, 1.459, 1.720, and 1.859 mm, respectively. It is observed that the SMA effect deteriorates as the number of stretching/contraction cycles increases. The uncertainty analysis is also reported. The expanded uncertainty was determined to be 201.61 mu m. (C) 2018 Optical Society of America

机译：电动形状记忆合金（SMA）在工程和科学中寻找广泛应用。已知这些材料保留/记住他们的状态。在应力/变形状态下，当通过施加合适的激励机制而激活时，例如使用热或潜力，它们返回原始的无重定状态。为了测试其可靠性，它是进行生命周期分析的标准程序。本文报道了使用Talbot干涉技术的SMA弹簧的生命周期分析。在位移漂移方面分析了SMA弹簧的生命周期，该漂移是因为由于其重复使用而产生的功能疲劳。来自通过分束器传输的HE-NE激光的准直光通过聚焦透镜通过聚焦透镜收敛到连接到弹簧的平面镜上。来自镜子的反向射灯是入射的一组两个由Talbot距离分开的ronchi光栅，形成莫尔图案。使用条纹旋转机构分析所得到的干涉图。取向角是位移漂移的函数。由于重复循环，SMA属性存在恶化，并且弹簧失去其返回其原始未拉伸位置的能力。在使用Talbot干涉仪测量的1,000,2000,3000,4000和5000这样的循环后产生的位移漂移的值分别为0,0.875,1.275,1.459,1.720和1.859 mm。观察到，随着拉伸/收缩循环的数量增加，SMA效果劣化。报告了不确定性分析。扩展的不确定性被确定为201.61亩。（c）2018年光学学会

Life cycle analysis of electrically actuated SMA spring using Talbot interferometry

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