In this investigation, we describe a combined low-coherence interferometric technique to measure the surface and thickness profiles of wafers at once with high speed. The measurement system consists of a spectrally resolved interferometer to provide and monitor the optical path difference between two incident beams of the optical source part and a low-coherence scanning interferometer to measure the dimensions of wafers with significantly shortened scanning length. In the experiments, a silicon wafer and a sapphire wafer, of which both sides are polished, were used as targets of the measurement system for verification of the proposed system. As a result, the scanning length of the low-coherence scanning interferometer was reduced from a few millimeters to a few hundreds of micrometers approximately 10 times. In addition, surface profiles of both sides and thickness profiles were simultaneously measured to reconstruct 3D shapes of wafers. (C) 2017 Optical Society of America
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