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首页> 外文期刊>International Journal of Computer Integrated Manufacturing >Parametric modeling and performance analysis of a personalized insole based on 3D scanning and selective laser sintering
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Parametric modeling and performance analysis of a personalized insole based on 3D scanning and selective laser sintering

机译：基于3D扫描和选择性激光烧结的个性化鞋垫的参数建模与性能分析

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摘要

Current design methods of individualized insoles are confronted with much-repeated work and are over-reliance on experiences. To tackle these problems, parametric modeling and selective laser sintering (SLS) were integrated for automatically generating personalized insoles in this study. 3D scanning was first used to achieve an individual's foot model and then an innovative parametric modeling program with an automatic line drawing module based on Grasshopper was developed. Additionally, both personalized insoles and flat insoles were manufactured via SLS technology and their performances were evaluated with finite element analysis and a Footscan system. The results show that the proposed parametric method of individualized insoles largely reduces the workload in comparison to traditional design, and can conveniently regulate the insole design for agreeable foot comfort. And the developed customized insoles with complex array structure can be successfully manufactured with SLS technology. Additionally, the personalized insole can reduce the peak contact pressure by 30% compared with the flat insole, and increase the strength and the durability of the insole, which is mainly attributed to the foot-fitting surface and the adopted array structure. The advantages and potential applications of the proposed parametric modeling method coupled with SLS technology were also discussed.
机译：当前的个性化鞋垫的设计方法面临着多次重复的工作，并对经验过度依赖。为了解决这些问题，集成参数建模和选择性激光烧结（SLS）被整合用于在本研究中自动生成个性化鞋垫。 3D扫描首先用于实现个体的脚模型，然后开发了一种基于蚱蜢的自动线描模块的创新参数建模程序。此外，通过SLS技术制造个性化鞋垫和扁平鞋垫，并通过有限元分析和脚踏体系评估它们的性能。结果表明，与传统设计相比，所提出的个性化鞋垫的参数化方法大大降低了工作量，可以方便地调节鞋垫设计以获得舒适的脚舒适。并且，具有复杂阵列结构的开发的定制鞋垫可以通过SLS技术成功地制造。此外，与扁平鞋垫相比，个性化鞋垫可以将峰值接触压力降低30％，并增加鞋底孔的强度和耐久性，主要归因于脚踏性表面和采用的阵列结构。还讨论了所提出的参数化建模方法与SLS技术耦合的优点和潜力应用。

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