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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper
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A new high entropy alloy brazing filler metal design for joining skutterudite thermoelectrics to copper

机译：一种新型高熵合金钎料，用于将Skutterudite热电与铜连接

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摘要

A new High Entropy Alloy (HEA) in the ZnGaCu-(AuSn) system was designed to join skutterudite thermoelectrics (CoSb2.75Sn0.05Te0.20), with a diffusion barrier of Ni applied, to Cu. Such a joint could be part of a device for thermal energy recovery within automotive exhaust systems. A rapid large-scale screening calculation technique based on Python programming has been introduced to conduct the HEA selection process, resulting in a series of alloys, which have been experimentally verified. It is demonstrated that a particular ZnGaCu-(AuSn) HEA alloy can join Ni and Cu successfully; a good joint is formed, and the average electrical contact resistance of the interfaces after joining is promising at room temperature, which shows that it has the potential to improve on the existing fillers used in such applications. The alloy design methodology used here suggests a potential efficient route to design new filler metals for a wide array of applications in which existing filler metals are not suitable. (C) 2020 The Author(s). Published by Elsevier B.V.
机译：在ZnGaCu-（AuSn）系统中设计了一种新的高熵合金（HEA），用于将skutterudite热电材料（CoSb2.75Sn0.05Te0.20）与铜连接，并在铜上施加了镍的扩散阻挡层。这种接头可能是汽车排气系统热能回收装置的一部分。介绍了一种基于Python编程的快速大规模筛选计算技术来进行HEA选择过程，得到了一系列经过实验验证的合金。结果表明，一种特殊的ZnGaCu-（AuSn）HEA合金可以成功地连接镍和铜；形成了良好的接头，并且在室温下，接头后界面的平均接触电阻很有希望，这表明它有可能改善此类应用中使用的现有填料。这里使用的合金设计方法为现有填充金属不适用的广泛应用设计新的填充金属提供了一种潜在的有效途径。（C） 2020作者。由Elsevier B.V.出版。

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