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Study on the shear-torsion deformation of rotary tube piercing process for nickel base superalloy

机译：镍基超合金旋转管刺穿过程的剪切扭转变形研究

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摘要

The separation layer defects (SLD) caused by shear-torsion deformation hinder the application of rotary tube piercing (RTP) process in the preparation of thick-walled tubes of nickel-base superalloy (TWNS). In this study, the influences of process parameters on the shear-torsion deformation of RTP process were studied, and the mathematic models between shear-torsion deformation and process parameters were established. The corresponding experiments were conducted to verify the simulation results, and the influences of shear-torsion deformation on the SLD and microstructure evolution were discussed. The results reveal that the SLD are attributed to the local shear/tensile stress near rolls and plug caused by the increases of circumferential shear deformation and longitudinal shear deformation under the condition of excessive roll speed and reduction rate. The increase of longitudinal shear deformation and circumferential shear deformation at the same time provides conditions for the generation of cracks, and the circumferential shear deformation directly leads to the propagation of SLD since the crack propagation direction is consistent with that of circumferential shear deformation. Under the common influences of compression deformation and shear-torsion deformation, the average grain size was significantly refined to 7-15 mu m after single pass RTP process. The IPF map reveals that the threedimensional shear-torsion deformation of RTP process is beneficial to the coordinated deformation of grains in all directions, and the dynamic recrystallization (DRX) grains without preferred orientation were obtained.
机译：剪切扭转变形引起的分离层缺陷（SLD）阻碍了旋转穿孔（RTP）工艺在镍基高温合金厚壁管制备中的应用。本文研究了RTP工艺参数对剪切扭转变形的影响，建立了剪切扭转变形与工艺参数之间的数学模型。为了验证模拟结果，进行了相应的实验，并讨论了剪切扭转变形对SLD和微观结构演变的影响。结果表明，在过大的轧制速度和压下率条件下，由于环向剪切变形和纵向剪切变形的增加，轧辊和轧塞附近的局部剪/拉应力导致了SLD。纵向剪切变形和周向剪切变形同时增加，为裂纹的产生提供了条件，而周向剪切变形直接导致SLD的扩展，因为裂纹扩展方向与周向剪切变形方向一致。在压缩变形和剪切-扭转变形的共同影响下，单道次RTP工艺后平均晶粒尺寸显著细化至7-15μm。IPF图显示，RTP工艺的三维剪切扭转变形有利于晶粒在各个方向的协调变形，并获得了无择优取向的动态再结晶（DRX）晶粒。

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