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Effect of small amounts of chalcogen alloying elements on the oxidation resistance of copper

机译:少量硫代菌合金元素对铜抗氧性的影响

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摘要

The effect of small amounts of chalcogen alloying elements (S, Se and Te) on the oxidation resistance (OR) of Cu has been investigated at 300-800 degrees C in 0.1 MPa oxygen atmospheres. Compared to pure copper, the addition of S, Se and Te could effectively improve the OR below 600 degrees C mainly owing to the chalcogen-element inclusions which hinder the diffusion of Cu. However, it becomes weak above 800 degrees C. In contrast, the failure at 800 degrees C is associated with the absence of those inclusions. The results are discussed in detail by the thermodynamic methods.
机译:None

著录项

  • 来源
    《Corrosion Reviews》 |2020年第6期|共8页
  • 作者单位

    Jilin Univ Sch Mat Sci &

    Engn Key Lab Automobile Mat Minist Educ Changchun 130022 Peoples R China;

    Jilin Univ Sch Mat Sci &

    Engn Key Lab Automobile Mat Minist Educ Changchun 130022 Peoples R China;

    Jilin Univ Sch Mat Sci &

    Engn Key Lab Automobile Mat Minist Educ Changchun 130022 Peoples R China;

    Jilin Univ Sch Mat Sci &

    Engn Key Lab Automobile Mat Minist Educ Changchun 130022 Peoples R China;

    Jilin Univ Sch Mat Sci &

    Engn Key Lab Automobile Mat Minist Educ Changchun 130022 Peoples R China;

    Jilin Univ Sch Mat Sci &

    Engn Key Lab Automobile Mat Minist Educ Changchun 130022 Peoples R China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 金属腐蚀与保护、金属表面处理;
  • 关键词

    chalcogen; copper; oxidation resistance; thermodynamic;

    机译:硫芥子;铜;抗氧化性;热力学;

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