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Novel organic-inorganic composites with high thermal conductivity for electronic packaging applications: A key issue review

机译：用于电子包装应用具有高导热性的新型有机 - 无机复合材料：关键问题综述

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摘要

Significant progress has been made recently in developing the organic-inorganic composites with high thermal conductivity, low dielectric constant, and dielectric loss, for applications in the electronic packaging and substrates. Many studies have shown that some polymers filled with high thermal conductivity and low dielectric loss ceramics are suitable for electronic packaging for device encapsulation. Until now, extensive attentions have been paid to the preparation of polymeric composites with high thermal conductivity and low dielectric loss for the application in electronic packaging. In contrast, the thermal conductivities of these dielectric materials are still not high enough and that might restrict their serviceable range. Herein, we briefly reviewed recent progress in this field and introduced a kind of novel composites with surface insulation modified metal aluminum cores to form multilayer coating structures as fillers in polyimide matrix for electronic applications. This structure can significantly improve the thermal conductivity and dielectric properties of composites and give some insights into the effects of modified fillers of composite materials. Such multilayer core-shell structures should have great potentials for the improvement of nanoparticle-based fillers and applications of electronic packaging. POLYM. COMPOS., 38:803-813, 2017. (c) 2015 Society of Plastics Engineers
机译：近年来，高导热、低介电常数、低介电损耗的有机-无机复合材料在电子封装和基板中的应用取得了重大进展。许多研究表明，一些填充有高热导率和低介电损耗陶瓷的聚合物适合用于器件封装的电子封装。迄今为止，制备高导热、低介电损耗的聚合物复合材料在电子封装中的应用受到了广泛关注。相比之下，这些电介质材料的热导率仍然不够高，这可能会限制其使用范围。在此，我们简要回顾了这一领域的最新进展，并介绍了一种表面绝缘改性金属铝芯的新型复合材料，以形成多层涂层结构，作为电子应用中聚酰亚胺基体的填料。这种结构可以显著提高复合材料的导热性和介电性能，并为复合材料改性填料的效果提供一些见解。这种多层核壳结构在纳米填料的改进和电子封装的应用方面具有巨大的潜力。博莱姆。COMPOS。，38:803-813, 2017. （c） 2015年塑料工程师学会

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  • 来源
    《Polymer Composites》 |2017年第4期|共11页
  • 作者

    Zhou Yongcun; Liu Feng; Wang Hong;

  • 作者单位

    Xi An Jiao Tong Univ Elect Mat Res Lab Key Lab Minist Educ Xian 710049 Peoples R China;

    Northwestern Polytech Univ State Key Lab Solidificat Proc Xian 710072 Shaanxi Peoples R China;

    Xi An Jiao Tong Univ Elect Mat Res Lab Key Lab Minist Educ Xian 710049 Peoples R China;

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  • 正文语种 eng
  • 中图分类 增强塑料、填充塑料;
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