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首页> 外文期刊>Journal of Materials Engineering and Performance >The Mechanical and Microstructural Changes of Sn-Ag-Bi Solders with Cooling Rate and Bi Content Variations
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The Mechanical and Microstructural Changes of Sn-Ag-Bi Solders with Cooling Rate and Bi Content Variations

机译：冷却速率和BI含量变化的SN-AG-BI焊料的机械和微观结构变化

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摘要

The purpose of this study is to investigate the influence of cooling rate and Bi addition on the microstructure evolution and mechanical properties of Sn-3.5Ag alloy. A series of Sn-3.5Ag-xBi solders has been fabricated with Bi content in the range of 0.5-3.5 wt.%. After solution heat treatment at 170 A degrees C for 24 h and subsequent aging heat treatment at 100 A degrees C for 2 h, samples were divided into two groups. One group was rapidly quenched into iced water (water quenching) for the fast cooling rate (20 A degrees C/s), while the second group was slowly cooled (furnace cooling) in the furnace for the slow cooling rate (0.2 A degrees C/s) after the furnace reflow. The microstructural evolutions of the present solders have been investigated using x-ray diffraction and scanning electron microscopy. The microhardness was measured to correlate the mechanical properties to alloy compositions and cooling rate. It was found that the microhardness of Sn-3.5Ag-xBi solders increased with increasing cooling rate. The indentation creep curves have been evaluated from the obtained microhardness values. Results revealed the steady-state creep rate decreased with increasing Bi content exhibiting an anomalous behavior at 2.5Bi. The reason for improved creep resistance of Sn-3.5Ag-xBi solders is the result of the combination of the solid solution strengthening and precipitation strengthening of Bi. The mean values of stress exponent indicated that the operative creep mechanism is dislocation climb.
机译：本研究的目的是研究冷却速度和添加铋对Sn-3.5Ag合金组织演变和力学性能的影响。制备了一系列铋含量在0.5-3.5 wt.%范围内的Sn-3.5Ag-xBi焊料。在170°C的固溶热处理24小时后，以及随后在100°C的时效热处理2小时后，将样品分为两组。一组在冰水中快速淬火（水淬火），以达到快速冷却速度（20 A摄氏度/秒），而第二组在熔炉回流后在熔炉中缓慢冷却（熔炉冷却），以达到缓慢冷却速度（0.2 A摄氏度/秒）。利用x射线衍射和扫描电子显微镜研究了当前焊料的微观结构演变。测量显微硬度以将机械性能与合金成分和冷却速度关联起来。结果表明，Sn-3.5Ag-xBi钎料的显微硬度随冷却速度的增加而增加。根据获得的显微硬度值评估了压痕蠕变曲线。结果表明，随着Bi含量的增加，稳态蠕变率降低，在2.5Bi时表现出异常行为。Sn-3.5Ag-xBi钎料抗蠕变性能提高的原因是Bi的固溶强化和沉淀强化相结合的结果。应力指数的平均值表明，有效的蠕变机制是位错爬升。

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