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首页> 外文期刊>Journal of Materials Engineering and Performance >Effect of Multiple Reflow Cycles and Al 2O 3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy
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Effect of Multiple Reflow Cycles and Al 2O 3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy

机译：多重回流循环和Al <下标> 2 O <下标> 3 纳米粒子增强对SAC305无铅焊料合金的性能的影响

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摘要

The effect of Al~(2)O~(3)nanoparticles reinforcement on melting behavior, microstructure evolution?at the interface and joint shear strength of 96.5Sn3Ag0.5Cu (SAC305) lead-free solder alloy subjected to multiple reflow cycles was investigated. The reinforced SAC305 solder alloy compositions were prepared by adding Al~(2)O~(3)nanoparticles in different weight fractions (0.05, 0.1, 0.3 and 0.5 wt.%) through mechanical dispersion. Cu/solder/Cu micro-lap-shear solder joint specimens were used to assess the shear strength of the solder joint. Differential scanning calorimetry was used to investigate the melting behavior of SAC305 solder nanocomposites. The solder joint interfacial microstructure was studied using scanning electron microscopy. The results showed that the increase in melting temperature ( T ~(L)) and melting temperature range of the SAC305 solder alloy by addition of Al~(2)O~(3)nanoparticles were not significant. In comparison with unreinforced SAC305 solder alloy, the reinforcement of 0.05-0.5 wt.% of Al~(2)O~(3)nanoparticles improved the solder wettability. The addition of nanoparticles in minor quantity effectively suppressed the Cu~(6)Sn~(5)IMC growth, improved the solder joint shear strength and ductility under multiple reflow cycles. However, the improvement in solder properties was less pronounced on increasing the nanoparticle content above 0.1 wt.% of the solder alloy.
机译：Al~（2）O~（3）纳米颗粒增强对熔融行为、微观结构演变的影响？在界面和接头处，抗剪强度为96.5Sn3Ag0。研究了5Cu（SAC305）无铅钎料合金在多次回流循环下的性能。通过机械分散添加不同重量分数（0.05、0.1、0.3和0.5 wt.%）的Al~（2）O~（3）纳米颗粒，制备了增强SAC305焊料合金成分。铜/焊料/铜微搭接剪切焊点试样用于评估焊点的剪切强度。采用差示扫描量热法研究了SAC305焊料纳米复合材料的熔化行为。利用扫描电子显微镜研究了焊点界面微观结构。结果表明，添加Al~（2）O~（3）纳米颗粒对SAC305钎料合金的熔化温度（T~（1））和熔化温度范围的提高不显著。与未增强SAC305焊料合金相比，0.05-0.5 wt.%Al~（2）O~（3）纳米颗粒的增强提高了焊料的润湿性。少量纳米颗粒的加入有效地抑制了Cu~（6）Sn~（5）IMC的生长，提高了焊点在多次回流循环下的剪切强度和延展性。然而，当纳米颗粒含量增加到焊料合金重量的0.1%以上时，焊料性能的改善不太明显。

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