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首页> 外文期刊>Journal of Materials Engineering and Performance >Effect of Void on Yielding Behaviors in a Bicrystalline Copper
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Effect of Void on Yielding Behaviors in a Bicrystalline Copper

机译：空隙对双铜铜产生行为的影响

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摘要

Nanovoids make a big contribution to the plasticity and failure of nanocrystalline metallic materials. To develop a further understanding of the role played by spherical voids in governing the plasticity of nanocrystalline metals, molecular dynamics simulations are performed on bicrystalline copper models with a spherical void at room temperature under 1 x 10(8) s(-1)strain rate. The simulation results indicate that the introduction of void lead to the reduction in yield stress with increasing void diameter. The spherical void acts as either a barrier or a source for dislocations. For intergranular spherical void, the dislocations are emitted from the intersections between the void and grain boundary (GB). However, the initial dislocation nucleation site transits from GBs to spherical void surface at a critical diameter of 9.5 nm in the models with intragranular void. According to the Lubarda model, the dislocation emission critical stress at intermediate void diameters is effectively predicted, but it is not applicable for the model with extremely large and small void since the factors of GB and grain orientation are not considered. Some more suitable models need to be developed.
机译：纳米空洞对纳米金属材料的塑性和破坏有很大的影响。为了进一步理解球形孔洞在纳米晶体金属塑性控制中的作用，在室温下，在1 x 10（8）s（-1）应变率下，对具有球形孔洞的双晶铜模型进行了分子动力学模拟。模拟结果表明，随着孔洞直径的增加，孔洞的引入导致屈服应力降低。球形空洞既可以作为位错的屏障，也可以作为位错的来源。对于晶间球形孔洞，位错从孔洞与晶界（GB）的交点发射。然而，在含有晶内空洞的模型中，初始位错形核位置在临界直径9.5nm处从GBs过渡到球形空洞表面。根据Lubarda模型，可以有效地预测中等孔隙直径处的位错发射临界应力，但由于未考虑晶界和晶粒取向的因素，该模型不适用于超大和小孔隙的模型。需要开发一些更合适的模型。

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