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首页> 外文期刊>Journal of Micromechanics and Microengineering >An efficient macro model for CMOS-MEMS thermal wind speed sensor
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An efficient macro model for CMOS-MEMS thermal wind speed sensor

机译：CMOS-MEMS热风速度传感器的有效宏模型

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摘要

In this paper, we propose a thermal wind speed sensor Verilog-A model with thermal-fluid-electric hybrid characteristics. Because the structure of the thermal wind sensor and the interface circuit chip are designed separately, which cannot effectively carry out MEMS-IC (integrated circuit) co-simulation, the overall performance of the sensor and interface circuit chip is prone to large deviation. At the same time, the separation of MEMS structure and IC design process leads to long product development cycle and high cost. This paper proposes an improved simulation model by analyzing the behavior characteristics of the thermal wind speed sensor. The simulation model consists of 11 thermistors, 3 capacitors, a voltage-controlled voltage source, and a voltage-controlled current source. The Taylor series expansion of the differential equation of heat conduction is carried out, and then the thermistor and capacitor networks are established according to the corresponding relationship between the thermal parameters and the electrical parameters, including the thermal conduction unit, the convection unit and the heat capacity in the chip. The model fully considers the effects of various physical effects and parasitic effects, and is implemented using the hardware description language Verilog-A. The sensor and interface circuit can be simulated simultaneously to optimize the circuit design. It is beneficial to the integration of sensors and interface circuit, reducing the number of tape-outs, increasing the success rate, and reducing costs. The consistency between the simulation results and the experimental curves verified the correctness of the macro model. The behavior characteristics of constant power (CP) and constant temperature heating were described. In CP mode, the output voltage error is less than +/- 6.5%, the chip temperature error is less than 4.0%. The presented modeling approach can be the basis for the development of complete MEMS-IC design technology library of thermal wind speed sensor, aiming at optimum designs of integrated thermal wind speed sensor.
机译：在本文中，我们提出了一种热风速传感器Verilog-a模型，该模型具有热-液-电混合特性。由于热风传感器和接口电路芯片的结构是分开设计的，无法有效地进行MEMS-IC（集成电路）协同仿真，传感器和接口电路芯片的整体性能容易出现较大偏差。同时，MEMS结构与IC设计过程的分离导致产品开发周期长、成本高。通过分析热风速传感器的行为特征，提出了一种改进的仿真模型。仿真模型由11个热敏电阻、3个电容、一个压控电压源和一个压控电流源组成。对热传导微分方程进行泰勒级数展开，然后根据热参数与电参数的对应关系建立热敏电阻和电容网络，包括芯片中的热传导单元、对流单元和热容。该模型充分考虑了各种物理效应和寄生效应的影响，并用硬件描述语言Verilog-A实现。可以同时对传感器和接口电路进行仿真，以优化电路设计。它有利于传感器和接口电路的集成，减少磁带输出的数量，提高成功率，降低成本。仿真结果与实验曲线的一致性验证了宏观模型的正确性。描述了恒功率（CP）和恒温加热的行为特征。在CP模式下，输出电压误差小于+/-6.5%，芯片温度误差小于4.0%。所提出的建模方法可以作为开发完整的热风速传感器MEMS-IC设计技术库的基础，以实现集成热风速传感器的优化设计。

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