首页> 外文期刊>Acta crystallographica.Section D. Biological crystallography >Structure determination of the minimal complex between Tfb5 and Tfb2, two subunits of the yeast transcription/DNA-repair factor TFIIH: a retrospective study.
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Structure determination of the minimal complex between Tfb5 and Tfb2, two subunits of the yeast transcription/DNA-repair factor TFIIH: a retrospective study.

机译:最小的结构测定复杂Tfb5 Tfb2,两个单元之间的酵母转录/ dna修复因子TFIIH: a回顾性研究。

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摘要

Tfb5 interacts with the Tfb2 subunit of the general transcription factor TFIIH to ensure efficient nucleotide-excision repair in eukaryotes. The crystal structure of the complex between Tfb5 and the C-terminal region of Tfb2 (Tfb2C) from Saccharomyces cerevisiae has recently been reported. Here, the structure-determination process is described as a case study. Although crystals were obtained readily, it was not possible to determine experimental phases from a first crystal form (Tfb2(412-513)-Tfb5(2-72)) that diffracted to 2.6 A resolution. Shortening of the Tfb2C from its N-terminus was decisive and modified the crystal packing, leading to a second crystal form (Tfb2(435-513)-Tfb5(2-72)). These crystals diffracted to 1.7 A resolution with excellent mosaicity and allowed structure determination by conventional approaches using heavy atoms. The refined structure from the second crystal form was used to solve the structure of the first crystal form by molecular replacement. Comparison of the two structures revealed that the N-terminal region of Tfb2C and (to a lesser extent) the C-terminal region of Tfb5 contributed to the crystal packing. A detailed analysis illustrates how variation in domain boundaries influences crystal packing and quality.
机译:Tfb5 Tfb2亚基的相互作用通用转录因子TFIIH确保高效的核苷酸切除修复真核生物。Tfb2 Tfb5和c端之间的地区从酿酒酵母(Tfb2C)最近报道。结构测定过程描述为一个案例研究。容易,它是不可能确定从第一个水晶形式实验阶段(Tfb2 (412 - 513) -Tfb5(2 - 72)),衍射到2.6一项决议。n端是决定性的和修改的水晶包装,导致第二晶体形式(Tfb2 (435 - 513) -Tfb5(2 - 72))。衍射到1.7的一项决议mosaicity并允许结构的决心传统的方法使用重原子。精致的结构从第二晶体的形式被用来解决的结构吗晶体形成的分子置换。两种结构的显示氨基端Tfb2C区域较小Tfb5 c端区域的贡献程度)水晶包装。说明变化域边界影响晶体包装和质量。

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