Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects

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Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects

机译：Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects

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摘要

We demonstrate a chip-scale micro-optical interconnect. The prototype system for this demonstration consists of optoelectronic transmitter and receiver multichip modules. A diffractive optical element (DOE) is used for optically interconnecting the multichip modules and in establishing a point-to-point link. The link length, as measured from the optical source of the transmitter to the detector plane of the receiver, is only 2.332 mm. The transmitter and receiver module dimensions as well as the integrated system volume are comparable to very large scale integration (VLSI). The design, fabrication, integration of this system, and experimental results are presented.

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《Optical Engineering》 |2003年第9期|2683-2688|共6页
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种英语
中图分类光学仪器;
关键词
transmitter and receiver multichip module; optical interconnects; flip-chip bonding; diffractive optics; vertical-cavity surface-emitting lasers; GaAs photodetector;

Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects

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