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机译:Influence of the curing cycle selection on the thermal degradation of an epoxy-diamine system
Univ Santiago de Compostela, Dept Fis Aplicada, Res Grp Terbipromat, Santiago De Compostela 15782, Spain;
activation energy; curing cycle; epoxy resins; thermogravimetry; TTT diagram; TTT CURE DIAGRAM; KINETIC-ANALYSIS; THERMOGRAVIMETRIC DATA; REACTIVE DILUENT; DIGLYCIDYL ETHER; N=0/1; 2 DCH; TEMPERATURE; TG;