Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern

Mike Mello; Bongtae Han; Zhaoyang Wang

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Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern

机译：Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern

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摘要

An IR diffraction interferometer is proposed for coplanarity measurement of high-density solder bump patterns. The method utilizes long-wavelength (λ=10.6 μm) coherent infrared laser light, which serves to reduce the apparent roughness of test objects and enables the regularly spaced solder bump arrays to produce well-defined diffracted wavefronts. A single diffracted wavefront is isolated by an optical system and directed to interfere with a reference wavefront to produce a wholefield map of bump topography. An optical configuration similar to classical Fizeau interferometry is implemented to prove the concept.

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来源
《Optical Engineering》 |2004年第4期|888-894|共7页
作者
Mike Mello; Bongtae Han; Zhaoyang Wang;
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作者单位

Intel Corporation Assembly Technology Development Design Process Development Chandler, Arizona;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种英语
中图分类光学仪器;
关键词
infrared diffraction; interferometer; bump patterns; wavefronts; coplanarity;

Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern

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