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Ultraviolet laser ablation patterning of oxide films for optical applications

机译：Ultraviolet laser ablation patterning of oxide films for optical applications

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Deep-UV (248 nm, 193 nm) excimer laser ablation is used to pattern thin oxide films or layer stacks. The ablation of extended areas as well as submicrometer structuring is possible. Due to their optical, chemical, and thermal stability, these inorganic films are better suited for optical applications compared to organic films, especially if UV transparency is required. The ablation of SiO_(2), Al_(2)O_(3), HfO_(2), and Ta_(2)O_(5) layers and combinations is investigated. Patterned films can be used as masks, diffractive phase elements, or gratings.

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