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Torsional and compression loading of paperboard packages: Experimental and FE analysis

机译：Torsional and compression loading of paperboard packages: Experimental and FE analysis

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摘要

The present study investigates torsional and compressive loading of a paperboard package. Finite element (FE) analyses simulating the tests were performed to improve understanding of the stresses and deformations in the paperboard during loading. A simple experimental characterization of the necessary material properties could be performed to represent the multi‐ply paperboard as a single‐ply structure. The results from the single‐ply model were compared with a laminate model, and the differences between the models were small. Comparing experimental and FE simulations of box compression and torsion showed that the FE models could accurately predict the response curves. However, in the simulations, there was an overprediction of the maximum compressive force and maximum torque, which was expected since geometrical imperfections and the heterogeneous internal structure of the material were not accounted for in the material model or the FE model. Local yield lines formed at the onset of non‐linearities in the package load–displacement curves. Therefore, the strength of the paperboard affects the maximum compressive strength and maximum torque, and the bending stiffness of the paperboard only had a minor effect. When a first local maximum was reached, the number of FE that reached the failure stress increased exponentially. The simulations also showed that box compression was not an effect of package height, but higher packages had a lower maximum torque.

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