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Engineering Route for Stretchable, 3D Microarchitectures of Wide Bandgap Semiconductors for Biomedical Applications

机译:Engineering Route for Stretchable, 3D Microarchitectures of Wide Bandgap Semiconductors for Biomedical Applications

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摘要

Wide bandgap (WBG) semiconductors have attracted significant researchinterest for the development of a broad range of flexible electronic applications,including wearable sensors, soft logical circuits, and long-termimplanted neuromodulators. Conventionally, these materials are grown onstandard silicon substrates, and then transferred onto soft polymers usingmechanical stamping processes. This technique can retain the excellentelectrical properties of wide bandgap materials after transfer and enablesflexibility; however, most devices are constrained by 2D configurations thatexhibit limited mechanical stretchability and morphologies compared with3D biological systems. Herein, a stamping-free micromachining processis presented to realize, for the first time, 3D flexible and stretchable widebandgap electronics. The approach applies photolithography on both sidesof free-standing nanomembranes, which enables the formation of flexiblearchitectures directly on standard silicon wafers to tailor the optical transparencyand mechanical properties of the material. Subsequent detachment ofthe flexible devices from the support substrate and controlled mechanicalbuckling transforms the 2D precursors of wide band gap semiconductorsinto complex 3D mesoscale structures. The ability to fabricate wide band gapmaterials with 3D architectures that offer device-level stretchability combinedwith their multi-modal sensing capability will greatly facilitate the establishmentof advanced 3D bio-electronics interfaces.

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