PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS

Basant Singh Sikarwar; Krishna Mohan Singh; Balkrishna Mehta

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PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS

机译：PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS

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The International Symposium on Fluids and Thermal Engineering, FLUTE 2021, is an international peer-reviewed academic symposium organized by the Department of Mechanical Engineering at Amity School of Engineering & Technology, Amity University Uttar Pradesh, India on July 22, 2021. FLUTE 2021 provides a forum to promote rapid communication and exchange ideas between researchers, scientists, and engineers in the field of fluid and thermal engineering. The theme of FLUTE 2021 was "Thermal Management of Electronic Devices and Components." With the rapid growth of manufacturing technologies during the past decade, electronic components and devices are exposed to the developing trends for (ⅰ) multi-functionality and (ⅱ) miniaturization that simultaneously requires larger electronic power and smaller chip component sizes. Consequently, there are increasing challenges for preventing electronic devices from overheating, which badly affects their working efficiency and lifetime. Hence, an effective thermal management approach is essential for guaranteeing the normal working efficiency and safety of electronic components. In general, the thermal management techniques of electronic devices and components could be classified into two categories: (ⅰ) active cooling and (ⅱ) passive cooling. However, active cooling becomes highly limited for miniaturized electronic devices because it usually requires sufficient space and additional power. It also has the issues of high noise levels and difficulty in maintenance. For this reason, reliable passive cooling has become essential and attractive for improving the thermal performance and life cycle of small electronic components.

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《Journal of enhanced heat transfer: Theory and application in high performance heat and mass transfer》 |2022年第3期|ⅴ-ⅵ|共2页
作者
Basant Singh Sikarwar; Krishna Mohan Singh; Balkrishna Mehta;
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作者单位

Department of Mechanical Engineering Amity School of Engineering & Technology Amity University, Uttar Pradesh, India;

Department of Mechanical and Industrial Engineering Indian Institute of Technology, Roorkee, India;

Department of Mechanical Engineering Indian Institute of Technology, Bhilai, India;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种英语
中图分类热力工程、热机;
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PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS

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