A Method and Analysis to Enable Efficient Piezoelectric Transducer-Based Ultrasonic Power and Data Links for Miniaturized Implantable Medical Devices

Soner Sonmezoglu; Ali Darvishian; Konlin ShenMauricio J. BustamanteAveral KandalaMichel M. Maharbiz

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A Method and Analysis to Enable Efficient Piezoelectric Transducer-Based Ultrasonic Power and Data Links for Miniaturized Implantable Medical Devices

机译：A Method and Analysis to Enable Efficient Piezoelectric Transducer-Based Ultrasonic Power and Data Links for Miniaturized Implantable Medical Devices

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Acoustic links for implantable medical devices (implants) have gained attention primarily because they provide a route to wireless deep-tissue systems. The miniaturization of the implants is a key research goal in these efforts, nominally because smaller implants result in less acute tissue damage. Implant size in most acoustic systems is limited by the piezoelectric bulk crystal used for power harvesting and data communication. Further miniaturization of the piezocrystal can degrade system power transfer efficiency and data transfer reliability. Here, we present a new method for packaging the implant piezocrystal; the method maximizes power transfer efficiency ( $eta $ ) from the acoustic power at the piezo surface to the power delivered to the electrical load and information transfer across the acoustic link. Our method relies on placing piezo-to-substrate anchors to the piezo regions where the vibrational displacement of the mode of interest is zero. To evaluate our method, we investigated packaged $1times 1times1$ mm3 piezocrystals assembled with different sized anchors. Our results show that reducing the anchor size decreases anchor loss and thus improves piezo quality factor (Q). We also demonstrate that this method improves system electromechanical coupling. A strongly coupled, high-Q piezo with properly sized and located anchors is demonstrated to achieve significantly higher $eta$ and superior data transfer capability at resonance. Overall, this work provides an analysis and generic method for packaging the implant piezocrystal that enables the design of efficient acoustic power and data links, which provides a path toward the further miniaturization of ultrasonic implants to submillimeter scales.

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《IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control》 |2021年第11期|3362-3370|共9页
作者
Soner Sonmezoglu; Ali Darvishian; Konlin ShenMauricio J. BustamanteAveral KandalaMichel M. Maharbiz;
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作者单位

Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA;

Department of Cellular and Molecular Pharmacology, University of California, San Francisco, San Francisco, CA, USA;

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原文格式 PDF
正文语种英语
中图分类无线电设备、电信设备;
关键词
Implants; Acoustics; Uplink; Backscatter; Wireless communication; Substrates; Loss measurement; Acoustic link; anchor loss; packaging; piezoelectric crystal; ultrasonic implant; ultrasonic power transfer;

A Method and Analysis to Enable Efficient Piezoelectric Transducer-Based Ultrasonic Power and Data Links for Miniaturized Implantable Medical Devices

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