Reversible bonding of microfluidics: Review and applications

Zhang Y.; Sun K.; Xie Y.Liang K.Zhang J.Fan Y.

首页> 外文期刊>Review of Scientific Instruments >Reversible bonding of microfluidics: Review and applications

【24h】

Reversible bonding of microfluidics: Review and applications

机译：Reversible bonding of microfluidics: Review and applications

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相关主题

摘要

With the development of microfluidic technology, new materials and fabrication methods have been constantly invented in the field of microfluidics. Bonding is one of the key steps for the fabrication of enclosed-channel microfluidic chips, which have been extensively explored by researchers globally. The main purpose of bonding is to seal/enclose fabricated microchannels for subsequent fluid manipulations. Conventional bonding methods are usually irreversible, and the forced detachment of the substrate and cover plate may lead to structural damage to the chip. Some of the current microfluidic applications require reversible bonding to reuse the chip or retrieve the contents inside the chip. Therefore, it is essential to develop reversible bonding methods to meet the requirements of various applications. This review introduces the most recent developments in reversible bonding methods in microfluidics and their corresponding applications. Finally, the perspective and outlook of reversible bonding technology were discussed in this review.

著录项

来源
《Review of Scientific Instruments》 |2023年第6期|061501-1-061501-10|共10页
作者
Zhang Y.; Sun K.; Xie Y.Liang K.Zhang J.Fan Y.;
展开▼
作者单位

School of Mechanical and Electrical Engineering, Beijing University of Chemical Technology;

LK Injection Molding Machine Co., Ltd.;

College of Electronic Science and Control Engineering, Institute of Disaster Prevention;

展开▼
收录信息
原文格式 PDF
正文语种英语
中图分类仪器、仪表;
关键词

Reversible bonding of microfluidics: Review and applications

摘要

著录项

相关主题

期刊订阅