机译:Modelling the Elastic Energy of a Bifurcated Wafer: a Benchmark of the Analytical Solution vs. The ANSYS Finite Element Analysis
STMicroelectronics, ADG R&D, Str Primosole 50, I-95121 Catania, Italy;
Bifurcation; Wafer; Warpage; Curvature; Finite Element Analysis (FEA); Simulations;