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首页> 外文期刊>Journal of Applied Polymer Science >High-temperature resistant polyimide-based sandwich-structured dielectric nanocomposite films with enhanced energy density and efficiency
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High-temperature resistant polyimide-based sandwich-structured dielectric nanocomposite films with enhanced energy density and efficiency

机译：High-temperature resistant polyimide-based sandwich-structured dielectric nanocomposite films with enhanced energy density and efficiency

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摘要

Development of advanced dielectric materials with both high-electric energy density and high-temperature resistant attributes is highly desirable in modern electronics and electrical systems. Herein, a series of polyimide (PI)-based sandwich-structured dielectric nanocomposite films have been attempted to develop the advanced high-temperature resistant capacitor films, wherein the boron nitride nanosheets/PI nanocomposite acts as the outer layers and the zinc oxide (ZnO)/PI as the middle layer. Benefitting from the merits of both fillers and the unique structure, the resulting nanocomposite films can simultaneously achieve both high-dielectric constant and high-breakdown strength, as well as low-electrical conduction loss, thus leading to improved discharged energy densities (U-e) and charge/discharge efficiency (eta) at elevated temperatures. It is found that the sandwich-structured nanocomposite film with 0.4 vol ZnO (0.4ZnO/PI-S) can deliver a maximum U-e of 5.29 J cm(-3) at 400 MV m(-1) and 150 degrees C, which is about 1.9 times that of the pristine PI film. Moreover, outstanding dielectric stability over 10,000 charge/discharge cycles has been demonstrated in such PI-based sandwich-structured nanocomposite films at 150 degrees C and 200 MV m(-1). This research may provide a new paradigm to explore polymer nanocomposites having excellent energy storage and efficiency at elevated temperatures.

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