...
首页> 外文期刊>Journal of computational electronics >Ultra-thin double barrier AlGaN/GaN high threshold voltage HEMT with graded AlGaN/Si_3N_4 gate and p-type buffer layer
【24h】

Ultra-thin double barrier AlGaN/GaN high threshold voltage HEMT with graded AlGaN/Si_3N_4 gate and p-type buffer layer

机译:Ultra-thin double barrier AlGaN/GaN high threshold voltage HEMT with graded AlGaN/Si_3N_4 gate and p-type buffer layer

获取原文
获取原文并翻译 | 示例
           

摘要

An ultra-thin double barrier enhancement mode (E-mode) AIGaN/GaN high-electron mobility transistor (HEMT) with p-type buffer layer and Si_3N_4/graded p-AlGaN gate is proposed and investigated by Silvaco TCAD. The simulation results show that the designed HEMT can obtain a high threshold voltage over 5.0 V and large gate swing. The maximum gate leakage current is 3.11 × 10~(-4) A/mm at 30 V gate voltage, which decreases four orders of magnitude compared to the conventional double barrier HEMTs. Due to the p-type buffer layer, the cut-off frequency for the proposed HEMT is raised over three-times compared to the conventional double barrier structure HEMT with n-type buffer layer. Meanwhile the designed HEMT exhibits high breakdown voltage and large current-gain. Moreover, the impacts of Si_3N_4 layer thickness under gate and GaN channel layer thickness are analyzed. Both layers play significant roles in obtaining high threshold voltage for the device by adjusting the conduction band energy of AlGaN/GaN interface potential well.

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号