Filling hexagonal boron nitride (h-BN) is a hot topic in the research of improving the thermal conductivity of polymer composites. Conversely, its difficulty in dispersing and forming a three-dimensional thermal network has become a major problem. This article uses liquid resin can effectively help the filler to be evenly dispersed and construct a multi-layer connection network through 3D printing technology, which improves the thermal conductivity of polymer effectively. With the addition of 30 wt h-BN, the thermal conductivity of the epoxy acrylate (EA) composite reaches 1.60 Wm(-1) K-1, which is 6.8 times that of pure epoxy acrylic resin. Our work provides a new idea for improving the thermal conductivity of photocured polymers.
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