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首页> 外文期刊>Polymers for advanced technologies >Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators
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Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators

机译：Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators

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摘要

Latent curing accelerators are significant for curing and molding controlling of epoxy molding compounds. Two novel phosphonium silicate latent accelerators, tetraphenylphosphonium bis(2,3-dioxy-naphthalene)methylsilicate (P-Si-Me) and tetraphenylphosphonium bis(2,3-dioxy-naphthalene)phenylsilicate (P-Si-Ph) were synthesized and characterized. The catalytic performance of P-Si-Me and P-Si-Ph on epoxy/phenolic resin system was evaluated and compared with commercial organophosphine accelerators triphenyl phosphine (TPP) and triphenylphosphine-1,4-benzoquinone (TPP-BQ). Systems with four accelerators displayed similar autocatalytic curing reaction mechanism, and the curing and rheological behavior of four epoxy systems could be well described with the diffusion factor-incorporated Kamal model, and Castro and Macosko model, respectively. DSC and rheology results showed that the latency of four accelerators followed the order of P-Si-Ph approximate to TPP-BQ >> P-Si-Me > TPP, while the catalytic reactivity followed TPP > P-Si-Me > P-Si-Ph > TPP-BQ. DMA results exhibited that epoxy systems with phosphonium silicate accelerators had higher T-g than that with TPP and TPP-BQ. The latency and catalytic performance of phosphonium silicate accelerators were attributed to their ionic complex nature. Moreover, the substituent on silicate anion had obvious impact on the performance of accelerators.

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