...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Microelectromechanical Systems: A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems >Effects of Remote Boundary Conditions on Clamping Loss in Micromechanical Resonators
【24h】

Effects of Remote Boundary Conditions on Clamping Loss in Micromechanical Resonators

机译：Effects of Remote Boundary Conditions on Clamping Loss in Micromechanical Resonators

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相关主题

摘要

Clamping loss in micromechanical resonators can strongly depend on the boundary conditions far away from the actual vibrating structure because the acoustic wavelength greatly exceeds the device dimensions. We demonstrate a scheme for post-fabrication tuning of the clamping loss in flexural-mode and bulk-mode resonators by modifying the boundary conditions of the chip with the frame. The measured quality factor increases by more than an order-of-magnitude for the microcantilevers and more than a factor of three for the bulk-mode resonators when frame contact is minimized via suspension of the chip by wirebonds. We propose a two-degree-of-freedom fluctuation-dissipation model to describe the thermomechanical noise and forced response in the presence of this tunable anchor damping. By studying the thermomechanical displacement spectrum with tunable clamping loss, we show that variable clamping loss tunes the mechanical quality factor, modifying both the resonator transfer function and thermomechanical noise force. We delineate the dependence of the tunable clamping loss mechanism on microcantilever beam length and ambient temperature from 300 K down to 40 K, and observe potential temperature dependence to clamping loss with reducing temperature. 2021-0141

著录项

获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号