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机译:A CMOS Image Sensor Based on Unified Pixel Architecture With Time-Division Multiplexing Scheme for Color and Depth Image Acquisition
Institute of Microelectronics, A*STAR, Singapore;
Binning operation; CMOS image sensor; charge transfer speed; demodulation pixel; depth sensor; four-shared architecture; high-gain readout; multiresolution; range finding; standard pinned-photodiode; three-dimensional (3-D) image sensor; time-division; time-of-flight (TOF);