AbstractThis article describes a flow electroanalysis (FEA) alternative to the atomic absorption spectrometry (AAS) procedure commonly employed for the compositional assay of Cu‐Ni alloy thin films. Nine alloy film samples were plated on polycrystalline Au foil by varying the deposition potential and the concentration of Cu2+ions in the plating bath to afford alloys varying in copper content from ca. 10 to ca. 70 (by mass). The FEA technique is based on first chemically stripping the alloy components from the support into the flow stream. The Cu2+ions are then analyzed by differential pulse anodic stripping voltammetry (DPASV) at a thin film mercury electrode. Since these Cu2+ions interfere with nickel analyses by DPASV, they are removed from the flow stream at a “filter” cell containing a Hg‐coated reticulated vitreous carbon electrode. The nickel content of the alloy can then be assayed at the downstream detector cell. The data from this twin‐cell FEA procedure are compared with those obtained on the same alloy samples by the standard AAS
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