Electroless Metallization of Dendrimer-Coated Micropatterns

Alexander M. Bittner; Xiao C. Wu

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Electroless Metallization of Dendrimer-Coated Micropatterns

机译：Electroless Metallization of Dendrimer-Coated Micropatterns

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We combined microcontact printing (μCP), the chemical modification of surfaces, and the binding and reduction of metal ions to produce arrays of metal clusters and metal patterns. Pd~(2+) was bound in and at polyamine-amide (PAMAM) dendrimer molecules with potential ligands (amides nd amines or carboxylate). Pd clusters formed after reduction. They provided chemically well-defined nuclei for the electroless deposition of metals. After producing a passivation pattern with μCP, deposition occurred only on those pixels or lines that were covered with Pd clusters. The method is quite general, as exemplified by two different passivation examples, alkanethiolate on gold and alkylsilane on oxidized silicon wafers.

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《Advanced functional materials》 |2002年第7期|432-436|共5页
作者
Alexander M. Bittner; Xiao C. Wu;
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Max-Planck-Institut fur Festkorperforschung Heisenbergstr. 1, D-70569 Stuttgart (Germany);

Max-Planck-Institut fur Festkorperforschung Heisenbergstr. 1, D-70569 Stuttgart (Germany)Max-Planck-Institut fur Festkorperforschung Heisenbergstr. 1, D-70569 Stuttgart (Germany);

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正文语种英语
中图分类无线电电子学、电信技术;
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Electroless Metallization of Dendrimer-Coated Micropatterns

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