AbstractA high molecular weight polyamide–imide polymer derived from the reaction of TMAC–DAPE has been prepared and its film properties have been evaluated. Poly‐N,N′‐(4,4′‐diphenyl ether) 4‐amidophthalimide film has an excellent combination of mechanical, electrical, and chemical properties at room temperature and at 200°C. A comparison of the film properties of this material with those of a commercial polyimide film, Teflon, FEP, Nomex paper, and Mylar films i
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