AbstractToray's ionic‐type photosensitive polyimide, “Photoneece”, is widely used as an interdielectric and as a protection layer for microelectronics, because of its properties, such as the removal of photoreactive groups at low temperature, excellent thermal, mechanical and electrical film properties and excellent adhesion to various substrates. Toray has developed a new type of “Photoneece”, UR‐5100, which is a low‐stress photosensitive polyimide. In addition to a low thermal expansion coefficient (25 ppm/°C), “Photoneece” UR‐5100 also features high resolution with an aspect ratio of more than 2.0 in 40 μm imaged film, and excellent mechanical properties in the cured film such as high elongation (>20) and tensile strength (>200 MPa), even after 60 hr heat treatment at 350°C. “Photoneece” UR‐5100 can be applied in multichip modules (MCMs), hybrid circuits, ICs and LSIs. In this paper the characterization and processing of this “Pho
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