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>Thermal conductivity, specific heat, and dynamic mechanical behavior of diglycidyl ether of bisphenol a cured withm‐phenylenediamine
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Thermal conductivity, specific heat, and dynamic mechanical behavior of diglycidyl ether of bisphenol a cured withm‐phenylenediamine
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机译：Thermal conductivity, specific heat, and dynamic mechanical behavior of diglycidyl ether of bisphenol a cured withm‐phenylenediamine
AbstractThe thermal conductivity, specific heat, and dynamic mechanical behavior of an epoxide system have been investigated over a relatively wide temperature range. Effects of nonstoichiometric amine concentrations and postcure heat treatments were included in the study. The thermal conductivity behavior was found to be related to the extent of cure of the poxy system, but in general the results were typical of an amorphous polymer. Calorimetric determinations were used to study the curing reaction and the glasslike transition temperature for the various systems. Dynamic mechanical results were employed to delinearte the various internal relaxations of the cured materials and in some instances to permit correlation of relaxations with the thermal conductivity and the specific heat results. From comparison of present results to those of a previous paper, the activation energy for the relaxation process occurring near 270°K has been estimated to be 16 kcal/mole
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