Engineering Technology Associates, Inc. (ETA), Troy, Ml, has released Dynaform Version 5.9, which includes a new optimization platform (OP) module for die-system simulation and optimization. Embedded in the software is proprietary Sherpa optimization technology from Red Cedar Technology, focused on supporting optimization of draw-bead forces along with binder pressure, lubrication, gauge and material. The OP module promises to reduce product development time and manufacturing costs by reducing incidents of wrinkling, thinning and tearing with limited effort (see before and after photos). The OP guided user interface makes optimization viable for a larger set of users, since special optimization expertise is not required, say company officials. Additionally, the latest computing platforms combined with an efficient solver eliminate demanding computing requirements.
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