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New thermally isolated pixel structure for high-resolution (640 X 480) uncooled infrared focal plane arrays

机译：New thermally isolated pixel structure for high-resolution (640 X 480) uncooled infrared focal plane arrays

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摘要

A new pixel structure with twice-bent beams and eaves structure, suitable for high-resolution uncooled infrared (IR) focal plane arrays (FPAs), is proposed. In comparison with previous results (FPA of 37-(mu)m pixel pitch), the thermal conductance of the test device with the proposed pixel structure of 23.5-(mu)m pitch is reduced about 2.5 times. The eaves structure, which is adopted to increase the fill factor of pixels, improves the responsivity by a factor of 1.3. A 640 X 480 bolometer-type uncooled IRFPA is demonstrated by utilizing the new pixel structure, with supplementary modification to improve thermal conductance and thermal time constant. It shows a noise equivalent temperature difference (NETD) of 50 mK for F/1.0 optics at 30 frames/sec, a thermal conductance of 0.03 (mu)W/K, and a thermal time constant of 16 msec.

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