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Peel adhesion apparatus using the compound pendulum and its practical performance

机译:Peel adhesion apparatus using the compound pendulum and its practical performance

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AbstractAn apparatus for measuring the peel adhesion behavior is developed on the basis of the circular motion of the compound pendulum. The peel force versus peel rate characteristics at the increasing and decreasing rates of peeling can be measured in a half cycle of rotation of the pendulum. A personal computer plays the important roles of operating the automated apparatus and processing data in real time. To test practical performance of the apparatus, the relation between peel force and rate of peeling was investigated for various pressuresensitive adhesive (PSA) tapes over a wide peel rate range. The respective curves in peel force versus peel rate in the increasing and decreasing rate processes are consistent with each other in the rate regions where cohesive or interfacial failures occur; while in the transition region between their failures, it appears that a peel hysteresis exists. Furthermore, the conventional testing under constant rate was repeated, and good agreement with the results from the present apparatus was obtained.

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