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A Reliable Heat Sink for Low Temperature Applications

机译:A Reliable Heat Sink for Low Temperature Applications

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The thermal conductance of metallized ceramic heat sinks obtained from ``offhyphen;thehyphen;shelf'' electronic components at 4.2 and 77.3 K is reported. These metallized ceramics are good low temperature heat sinks, rugged and repeatedly softhyphen;solderable, with a low electrical capacitance and very high electrical resistivity.

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