In semiconductor manufacturing, static charge control reduces product losses caused by contamination, ESD, and a variety of equipment-related problems. Grounding of conductors and air ionization for insulators are the primary methods available for controlling static charge. These methods should apply in all parts of the semiconductor manufacturing process, starting in the silicon foundry and mask house and extending through packaging and shipping of finished devices. As noted by the ITRS, "Technology change assures that static charge problems will get worse.... As critical dimensions shrink, the presence of static charge becomes a technology barrier.... Limiting charge levels throughout the factory to protect devices will also avoid malfunctions due to ESD-related EMI in equipment and improve overall equipment efficiency...." Eliminating static charge in semiconductor manufacturing has the clear benefits of improved yield and quality and lower costs for maintenance and rework. The result is higher profits. For the semiconductor industry to progress along its technology roadmap, static charge control is not an option, it is a requirement.
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