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首页> 外文期刊>Journal of thermal analysis and calorimetry >Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids
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Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

机译：Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids

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We investigated the thermal performance of micro-hole cellular structure using Al2O3-H2O and CuO-H2O nanofluids with 0.67 and 0.4, respectively, of volumetric concentration numerically and then validated these numerical results with the experimental results at a heating power of 345W. We found that the thermal conductivities of Al2O3-H2O and CuO-H2O nanofluids were enhanced by 2 and 1.19, respectively, as compared to the base fluid (water). Using Al2O3-H2O nanofluids, we achieved the minimum base temperature of 24.5 degrees C and 26.6 degrees C numerically and experimentally, respectively, for the micro-hole cellular structure. Using CuO-H2O nanofluids, we achieved the minimum base temperature of 25.5 degrees C and 27.7 degrees C numerically and experimentally, respectively. The estimated errors between obtained numerical and experimental results were 8.8 and 8.5 for Al2O3-H2O and CuO-H2O, respectively. Experimentally, we achieved the lowest base temperature of 26.6 degrees C and 27.7 degrees C using Al2O3-H2O and CuO-H2O nanofluids, respectively, which was about 17.6 and 14.5 lower than the reported temperature value of 32.3 degrees C using water (Tariq et al. in Therm Sci, 2018. http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T).

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