Crack Propagation Behavior at Sn37Pb-copper Interface in Low Cycle Fatigue

Masao Sakane; Kazuhiro Itoh; Yutaka TsukadaKenji Terada

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Crack Propagation Behavior at Sn37Pb-copper Interface in Low Cycle Fatigue

机译：Crack Propagation Behavior at Sn37Pb-copper Interface in Low Cycle Fatigue

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摘要

This paper studies the crack propagation at Sn37Pb-copper interface in push-pull low cycle fatigue. Bonded specimens of Sn37Pb and copper having notch holes with different distances from the interface were fatigued at 313K and the crack propagation paths were observed. Cracks propagated at the interface when the notch hole was near the interface but propagated in the solder when the notch hole was away from the interface. The propagation rate of the interfacial crack was faster than that of non-interface crack. The crack path and crack propagation rate of the two types of cracks were discussed in relation to J integral range calculated by finite element method.

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来源
《Key engineering materials》 |2007年第4期|2962-2965|共4页
作者
Masao Sakane; Kazuhiro Itoh; Yutaka TsukadaKenji Terada;
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作者单位

Department of Mechanical Engineering, Ritsumeikan University, Nojihigashi Kusatu-shi Shiga 525-8577, Japan;

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原文格式 PDF
正文语种英语
中图分类工程基础科学;
关键词
solder; crack propagation; interface; low cycle fatigue; j integral; crack path;

Crack Propagation Behavior at Sn37Pb-copper Interface in Low Cycle Fatigue

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