A clay additive may assist shape forming of silicon nitride bondedsilicon carbide (SNBSC) components, but it grossly complicates thereaction-bonding processes. This paper concentrations on one aspectof bond formation in such a system, namely the effects of clay on thenitridation of silicon. To prevent the potential for carbothermalnitridation-reduction, silicon carbide was excluded from sampleformulations. In essence, the melting of the clay by 1000 deg.C wassuggested to initiate nitridation earlier and hasten the initialreaction by increasing the local partial pressures of Si(g) andSiO(g).
展开▼
