机译:Materials and processing approaches for foundry-compatible transient electronics
Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA;
Northeastern Univ, Dept Elect & Comp Engn, Boston, MA 02115 USA;
X Celeprint Inc, Durham, NC 27709 USA;
soft electronics; biodegradable electronics; transfer printing; undercut etching; hydrolysis;