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Poly(N‐phenolicmaleimide) for high‐temperature stable near‐UV resist

机译：Poly(N‐phenolicmaleimide) for high‐temperature stable near‐UV resist

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AbstractPolyN‐(4‐hydroxyphenyl)maleimide (PHPMI) was prepared by the radical polymerization ofN‐(4‐acetoxyphenyl) maleimide, followed by transesterification of the acetoxy group. The cyclic maleimide group was responsible for high‐temperature stabilities. Thus, a high glass transition temperature of 227°C and a thermal decomposition temperature of 417°C were found. PHPMI sensitized by a diazonaphthoquinone or an aromatic bisazide was prepared and evaluated as a positive or a negative near‐UV resist. Microlithographic positive/negative images were obtained that were stable to temperatures higher than 200°C. The developed images showed no pattern deformation induced by swelling during development. © 1993 John

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