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机译:Channel temperature measurement in hermetic packaged GaN HEMTs power switch using fast static and transient thermal methods
Natl Chiao Tung Univ, Dept Mech Engn, 1001 Univ Rd, Hsinchu 30010, Taiwan;
Junction temperature; Power semiconductor device; Heating curve; Cooling curve; Transient thermal impedance (TTI); Safe operating area (SOA);