A Soft Ceramic Ti_3SiC_2 with Microscale Plasticity at Room Temperature

Shibo Li; Hongxiang Zhai

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A Soft Ceramic Ti_3SiC_2 with Microscale Plasticity at Room Temperature

机译：A Soft Ceramic Ti_3SiC_2 with Microscale Plasticity at Room Temperature

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Microscale plasticity of Ti_3SiC_2 was investigated by Vickers hardness indentation. The surface layer of the hardness indentations was removed by acid solution to observe microstructure beneath the indentations, where a large number of bending, delamination and kinking grains were found. These features suggest that Ti_3SiC_2 is able to consume microdamage around the indentations. Numerous basal plane dislocations and stacking faults lying in Ti_3SiC_2 grains or accumulating at grain boundaries were observed. The basal plane dislocations play an important role in the microscale plastic deformation. The plasticity and damage tolerance for Ti_3SiC_2 at room temperature should be attributed to multiple energy absorbing mechanisms: grains bending, delamination, kink-band formation, and the basal plane slip, etc.

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来源
《Key engineering materials》 |2005年第2期|1343-1346|共4页
作者
Shibo Li; Hongxiang Zhai;
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作者单位

School of Mechanical and Electronic Control Engineering, Beijing Jiaotong University, Beijing 100044, China;

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原文格式 PDF
正文语种英语
中图分类工程基础科学;
关键词
Ti_3SiC_2 ceramic; microscale plasticity; deformation; mechanisms.;

A Soft Ceramic Ti_3SiC_2 with Microscale Plasticity at Room Temperature

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