• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Key engineering materials >Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules
【24h】

Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules

机译：Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相关主题

摘要

LTCC technology offers low temperature firing (<900℃) of a materials system, which is based on LTCC sheets/tapes and (ideally) compatible thick-film components. Screen-printed materials on LTCC tapes, such as conductor, resistor, inductor thick-films are co-fired (simultaneously fired), providing a highly-functional package. This comes along with additional benefits such as ease of LTCC tape structuring, fabrication of hermetic and complex 3-D structures, etc. The major difficulty encountered arises from the differential shrinkage rate of LTCC tape and thick-film components, which has to be avoided for fabrication of warpage-free, flat surfaces that is vital for membranes, beams, etc. Therefore the goal of this study is the reduction of deformation, by matching the shrinkage rate of conductor with that of LTCC, which is achieved by mixing the commercially-available paste with selected additives.

著录项

获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号